White Paper
Plastics have been widely used in the interconnection industry for many years; recent developments have lead to an increase in the use of specialty thermoplastic compounds, which are custom formulated to the specific requirements of their end use.
Industry trends toward increasing circuit speeds and densities for integrated circuits have driven device manufacturers toward miniaturization, adoption of better surface mount technology methods, and continual cost reductions. As a result, manufacturers need improved specialty compounds to meet their more stringent material requirements.
The ability to optimize the performance of a plastic compound requires a thorough understanding of dimensional stability, processability, assembly/operating considerations, physical properties (mechanical, flame retardant, and electrical) and cost.
