Overview
Perfluoroalkoxy (PFA) compounds have excellent thermal and chemical resistance. Their mechanical properties are similar to FEP (RTP 3500 Series), though they have better heat resistance and can be used up to temperatures of 500 degrees F (260 degrees C).
PFA’s low dielectric constant allows it to be used in semiconductor manufacturing and many electrical applications. In order to avoid internal stresses, PFA should be processed at high temperatures — around 700 degrees F (371 degrees C) — and at slow rates.